三星电子将提升传统节点上的代工产能以满足增长的需求

埃律西昂

来源：BusinessKorea
原英文标题：《Samsung Electronics to Expand Foundry Capacity in Legacy Nodes》

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Samsung Electronics will expand its foundry capacity in legacy nodes starting this year.
‎三星电子将从今年开始扩大其在传统节点上的代工厂产能。‎

The move is aimed at securing new customers and boosting profitability by increasing the production capacity of mature processes for such items as CMOS image sensors (CISs), which are in growing demand due to a prolonged shortage.
‎此举旨在通过提高CMOS图像传感器（CIS）等成熟工艺的生产能力来确保新客户并提高盈利能力，这些产品由于长期短缺而需求不断增长。‎

At the same time, Samsung Electronics is planning to start volume production of advanced chips on its sub-3-nm fabrication process in the first half of this year.
‎与此同时，三星电子计划在今年上半年开始量产其3纳米以下制造工艺的先进芯片。‎

The company said in its 2021 business report that it is considering expanding its matured node capacity in the mid to long term as demand is expected to continue to stay strong.
‎该公司在其2021年业务报告中表示，正在考虑在中长期内扩大其成熟的节点容量，因为预计需求将继续保持强劲。
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The company added it is taking steps to sharpen its product competitiveness and is closely considering building new fabs through timely investment.
‎该公司补充说，它正在采取措施提高其产品竞争力，并正在仔细考虑通过及时投资建立新的晶圆厂

This marked the first time that Samsung Electronics suggested the possibility of expanding its capacity in legacy node. Samsung Electronics has been expanding investment in the system semiconductor sector for years. The company is expected to ramp up investment to expand legacy nodes this year. In 2021, Samsung Electronics’ facility investment reached an all-time high of 48.22 trillion won and increased 25.3 percent from a year ago.
‎这标志着三星电子首次提出扩大其传统节点容量的可能性。三星电子多年来一直在扩大对系统半导体领域的投资。预计该公司今年将加大投资以扩大传统节点。2021年，三星电子的设施投资达到48.22万亿韩元的历史新高，同比增长25.3%。

Samsung Electronics will also continue to introduce derivative process technologies that enhance performance and cost competitiveness by improving old processes. In October 2021, the company announced that it will increase production efficiency by applying a new fin field-effect transistor (FinFET)-based 17-nm process to the production of image sensors and mobile display driving ICs (DDIs) that have been produced on existing 28-nm processes of a flat structure.
‎三星电子还将继续推出衍生工艺技术，通过改进旧工艺来提高性能和成本竞争力。2021年10月，该公司宣布，将采用基于鳍式场效应晶体管（FinFET）的新型17纳米工艺，用于生产在平面结构的现有28纳米工艺上生产的图像传感器和移动显示器驱动IC（DDI），从而提高生产效率。‎

Thus far, Samsung Electronics has focused on developing advanced process technologies instead of legacy processes. However, as the legacy process market has grown to an unprecedented level due to a semiconductor boom, analysts say that Samsung Electronics is actively responding to demand expansion by scaling up related investments.
‎到目前为止，三星电子一直专注于开发先进的工艺技术，而不是传统工艺。然而，由于半导体热潮，传统工艺市场已发展到前所未有的水平，分析师表示，三星电子正在通过扩大相关投资来积极应对需求扩张。‎

In TSMC's case, the share of legacy nodes, which refer to 16-nm or above chipmaking processes, accounted for 50 percent of its revenue in 2021. Samsung accounts for about 40 percent of the global market in the advanced 10-nm or lower process sector. But its share is much smaller in the matured process segment.
‎在台积电的案例中，传统节点的份额，即16纳米或以上的芯片制造工艺，占其2021年收入的50%。三星在先进的10纳米或更低工艺领域约占全球市场的40%。但它在成熟工艺领域的份额要小得多

Samsung Electronics plans to secure up to 300 foundry customers by 2026 and triple production from the 2017 level.
‎三星电子计划到2026年获得多达300家代工厂客户，产量比2017年增加三倍。‎

Despite a difficulty in securing a desired yield, Samsung Electronics expressed its intention to carry out volume production on its 3-nm or below processes without a hitch. Samsung has built the world's first 3-nm process using gate all around (GAA) technology, which is expected to roll out chips in the first half of 2022. Its 2-nm process based on third-generation GAA technology will start volume production in 2025.
‎尽管难以确保所需的产量，但三星电子表示打算顺利地对其3纳米或以下工艺进行批量生产。三星已经构建了世界上第一个使用栅极全能（GAA）技术的3纳米工艺，预计将于2022年上半年推出芯片。基于第三代GAA技术的2纳米工艺将于2025年开始量产。‎

The company narrowed its technology gap with TSMC via volume production of 4-nm products in April 2021. “We plan to expand business opportunities by securing overseas trade lines and strengthening responsiveness to high-growth markets such as the high-performance computing (HPC) and automotive markets.”
‎该公司于2021年4月通过批量生产4nm产品缩小了与台积电的技术差距。"我们计划通过确保海外贸易线和加强对高性能计算（HPC）和汽车市场等高增长市场的响应能力来扩大商机。