线路板背部,为了降低大功率输出时PCB的发热,HCP850通过在高、低压侧大电流的走线阻焊上开窗,过回流焊时镀锡的方式,在有限PCB覆铜宽度下提高通流量,强化PCB传导及对流散热: 电源AC插座,插座引脚根部就近加焊一堆Y电容,常见的EMI应对策略: |
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